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Prototyping

Testing a DSP module on the aluminum breadboard.
Testing a DSP module on the aluminum breadboard.

Current prototyping system is to use a 12x12 inch aluminum square with power distribution board in the rear and 2x2x12 inch angle stock for mounting I/O and controls. The module being testing is mounted flat compared to how it would be in the cabinet. This setup can be stored relatively easily in a plastic container.

Not shown in the image above is that a solderless breadboard is easily integrated into this setup.

In general the strategy is to move from solderless breadboard to modular PCBs as rapidly as possible. Ideas tend to get “stuck” on the solderless breadboard.

Using a scrap panel and a breadboard, viewed from above.
Using a scrap panel and a breadboard, viewed from above.

My previous prototyping setup was just a panel and breadboard. Having the panel mounted vertically and wired to a breadboard is more awkward than a flat arrangement.

Using a scrap panel and a breadboard, viewed from behind.
Using a scrap panel and a breadboard, viewed from behind.